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Silicon Wafer Gettering Design for Advanced CMOS Image Sensors Using Hydrocarbon Molecular Ion Implantation: A Review

Authors :
Hidehiko Okuda
Koji Kobayashi
Takeshi Kadono
Ryosuke Okuyama
Yoshihiro Koga
Ryo Hirose
Ayumi Onaka-Masada
Satoshi Shigematsu
Akihiko Suzuki
Kazunari Kurita
Source :
IEEE Journal of the Electron Devices Society. 10:720-727
Publication Year :
2022
Publisher :
Institute of Electrical and Electronics Engineers (IEEE), 2022.

Abstract

Complementary metal-oxide-semiconductor (CMOS) image sensors have widely been used in internet of thinking (IoT) devices such as smartphones, smart watch and personal computer tablets [1] . The consumer market strongly requires higher sensitivity and higher speed image data processing to realize high functional CMOS image sensors such as three dimensionally stacked back-side-illuminated CMOS image sensors (3D-CIS) [2] . However, there are some serious technological issues in the fabrication of advanced CMOS image sensors as shown in Fig. 1 .

Details

ISSN :
21686734
Volume :
10
Database :
OpenAIRE
Journal :
IEEE Journal of the Electron Devices Society
Accession number :
edsair.doi.dedup.....ac3943fca4c3f09eabaae339cf78f8e0
Full Text :
https://doi.org/10.1109/jeds.2021.3135656