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Dielectric response of filled and flexibilized epoxy resin
- Source :
- IEEE International Symposium on Electrical Insulation ISEI 2012 Conference, IEEE International Symposium on Electrical Insulation ISEI 2012 Conference, 2012, Porto Rico, Puerto Rico
- Publication Year :
- 2012
- Publisher :
- IEEE, 2012.
-
Abstract
- In this work, several nanostructured microcomposite epoxy resin compounds, with or without flexibilized network, are analyzed. Scanning Electron Microscopy is used for the investigation of the phase separation between the flexibilizer and the polymer matrix. Differential Scanning Calorimetry results showed an enhanced molecular mobility for the polymer chains confirmed the expected influence of the flexibilizer. Also, the addition of micro and nanoparticles into epoxy resin increased the glass transition temperature since the fillers prevent the molecular movement of the polymeric chains. Broadband Dielectric Spectroscopy allowed us to determine the influence of the flexibilizer and the influence of the nano and micro filler ratio on the relaxation time versus temperature. After fitting the relaxation peaks using Havriliak-Negami functions, noticeable differences were observed for the β relaxation processes.
- Subjects :
- 010302 applied physics
chemistry.chemical_classification
Nanocomposite
Materials science
Scanning electron microscope
Relaxation (NMR)
Polymer
Epoxy
Dielectric
010402 general chemistry
01 natural sciences
[SPI.TRON]Engineering Sciences [physics]/Electronics
0104 chemical sciences
Differential scanning calorimetry
chemistry
visual_art
0103 physical sciences
visual_art.visual_art_medium
Composite material
Glass transition
ComputingMilieux_MISCELLANEOUS
Subjects
Details
- Database :
- OpenAIRE
- Journal :
- 2012 IEEE International Symposium on Electrical Insulation
- Accession number :
- edsair.doi.dedup.....abbf1597e4ec1fa8072a8ffbb6c22dac