Development of a Reliable Packaging for CMOS-based Microelectrode Arrays by Using an Automated Setup

We present a reliable and versatile microelectrode-array-device-packaging method for use in neurobiological research. The new packaging is simple, user-friendly, durable, and obviates any contamination of the sensitive electrodes (Figure 1). The packaging consists of a custom-designed injection-molded polycarbonate ring that is bonded to the surface of the CMOS chip with a specifically selected biocompatible adhesive. The utilization of capillary effects (Figure 3) in the packaging design eliminates any contamination and flooding of the sensitive electrode array by the adhesive compound or other substances. During the development phase, an automated setup was designed to measure the lifespan of the packaging; this setup was used to determine the optimal dimensions, appropriate adhesive compound and other required parameters.
Procedia Engineering, 87
EUROSENSORS 2014, the 28th European Conference on Solid-State Transducers