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Parallel Simulation of Loosely Timed SystemC/TLM Programs: Challenges Raised by an Industrial Case Study

Authors :
Jérôme Cornet
Matthieu Moy
Denis Becker
STMicroelectronics [Grenoble] (ST-GRENOBLE)
VERIMAG (VERIMAG - IMAG)
Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Centre National de la Recherche Scientifique (CNRS)-Université Grenoble Alpes [2016-2019] (UGA [2016-2019])
Source :
Electronics, Electronics, MDPI, 2016, 5 (2), pp.22. ⟨10.3390/electronics5020022⟩, Electronics; Volume 5; Issue 2; Pages: 22, Electronics, Vol 5, Iss 2, p 22 (2016)
Publication Year :
2016
Publisher :
HAL CCSD, 2016.

Abstract

International audience; Transaction level models of systems-on-chip in SystemC are commonly used in the industry to provide an early simulation environment. The SystemC standard imposes coroutine semantics for the scheduling of simulated processes, to ensure determinism and reproducibility of simulations. However, because of this, sequential implementations have, for a long time, been the only option available, and still now the reference implementation is sequential. With the increasing size and complexity of models, and the multiplication of computation cores on recent machines, the parallelization of SystemC simulations is a major research concern. There have been several proposals for SystemC parallelization, but most of them are limited to cycle-accurate models. In this paper we focus on loosely timed models, which are commonly used in the industry. We present an industrial context and show that, unfortunately, most of the existing approaches for SystemC parallelization can fundamentally not apply in this context. We support this claim with a set of measurements performed on a platform used in production at STMicroelectronics. This paper surveys existing techniques, presents a visualization and profiling tool and identifies unsolved challenges in the parallelization of SystemC models at transaction level.

Details

Language :
English
ISSN :
20799292
Database :
OpenAIRE
Journal :
Electronics, Electronics, MDPI, 2016, 5 (2), pp.22. ⟨10.3390/electronics5020022⟩, Electronics; Volume 5; Issue 2; Pages: 22, Electronics, Vol 5, Iss 2, p 22 (2016)
Accession number :
edsair.doi.dedup.....a224fdec0729dbdf69efd8d23e0d1890
Full Text :
https://doi.org/10.3390/electronics5020022⟩