Universal assembly of liquid metal particles in polymers enables elastic printed circuit board

MLA

Wonbeom Lee, et al. “Universal Assembly of Liquid Metal Particles in Polymers Enables Elastic Printed Circuit Board.” Science (New York, N.Y.), vol. 378, no. 6620, Nov. 2022. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi.dedup.....9e7bc5ec00cf2bfd386fa979a75cec23&authtype=sso&custid=ns315887.

APA

Wonbeom Lee, Hyunjun Kim, Inho Kang, Hongjun Park, Jiyoung Jung, Haeseung Lee, Hyunchang Park, Ji Su Park, Jong Min Yuk, Seunghwa Ryu, Jae-Woong Jeong, & Jiheong Kang. (2022). Universal assembly of liquid metal particles in polymers enables elastic printed circuit board. Science (New York, N.Y.), 378(6620).

Chicago

Wonbeom Lee, Hyunjun Kim, Inho Kang, Hongjun Park, Jiyoung Jung, Haeseung Lee, Hyunchang Park, et al. 2022. “Universal Assembly of Liquid Metal Particles in Polymers Enables Elastic Printed Circuit Board.” Science (New York, N.Y.) 378 (6620). http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi.dedup.....9e7bc5ec00cf2bfd386fa979a75cec23&authtype=sso&custid=ns315887.