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Interoperable Multi-Blockchain Platform Based on Integrated REST APIs for Reliable Tourism Management

Authors :
Wenquan Jin
Lei Hang
Do-Hyeun Kim
Linchao Zhang
Source :
Electronics; Volume 10; Issue 23; Pages: 2990, Electronics, Vol 10, Iss 2990, p 2990 (2021)
Publication Year :
2021
Publisher :
Multidisciplinary Digital Publishing Institute, 2021.

Abstract

The tourism industry can significantly benefit from the blockchain since its implementation can build trust among stakeholders and improve customer satisfaction. However, most of the existing tourism-specified blockchain platforms are single-chains that provide business support for enterprises without guaranteeing transaction information privacy. Besides, these platforms are specified to a single use case and lack interoperability with other platforms to support heterogenous tourism services. This paper aims to address this issue by introducing a multi-chain architecture that utilizes multiple blockchains to enhance processing capability and provide various business services for the tourism industry. The proposed multi-chain architecture improves the interoperability between the activities in different chains by providing functional requirements in practical applications and supports the inter-ledger application. In addition, the private blockchain will be made available to allow users to access the network through central authorization. It also increases the transaction processing capability by distributing multiple tasks across the chains for large-scale applications. To demonstrate the usability and efficiency of the developed approach, a case study on hotel booking is conducted using the blockchain frameworks Winding Tree and Hyperledger Fabric. A comprehensive evaluation experiment is conducted, and the results show the significance of the proposed system.

Details

Language :
English
ISSN :
20799292
Database :
OpenAIRE
Journal :
Electronics; Volume 10; Issue 23; Pages: 2990
Accession number :
edsair.doi.dedup.....9d0c408cbfae82687e9a8edc06d82a4f
Full Text :
https://doi.org/10.3390/electronics10232990