Experimental Investigation on Thermal Behaviors of Nanosilicon Carbide/Kenaf/Polymer Composite

Over the last few years, natural fiber-based hybrid polymers have been widely used to increase the biodegradability and cost-effectiveness of the products in many industrial applications, such as automobile construction industries. Adding filler materials provides enhanced wear properties and thermal behaviors of composites. Kenaf fiber has better strength and stiffness, and it has been used as reinforcement in polymer composites. Silicon carbide as filler material in composites modifies the mechanical properties and thermal behaviors. The present research analyzes the thermal characteristics of silicon carbide/kenaf fiber-reinforced epoxy composites with various weight percentages. Six different composite specimens were fabricated at varying weight percentages of silicon carbide. The specimens were subjected to various thermal tests, such as heat deflection temperature (HDT), coefficient of thermal expansion (CTE), thermal conductivity (TC), thermogravimetric analysis (TGA), and differential scanning calorimetry (DSC). The findings could serve to expand the range of application for SiC/kenaf fiber-reinforced composite, which may have better thermal stability, better performance, and lower thermal expansion than the other regularly used natural fiber-reinforced composites.