Back to Search
Start Over
Dimeric Self-assembling via Hydrogen Bonding and Emissive Behavior of a New Copper (I) Complex
- Source :
- Orbital: The Electronic Journal of Chemistry, Vol 9, Iss 1, Pp 89-94 (2017)
- Publication Year :
- 2017
- Publisher :
- Universidade Federal de Mato Grosso do Sul, 2017.
-
Abstract
- This work describes the synthesis, structural characterization and emissive behavior of a new copper (I) complex based on 1-thiocarbamoyl-5-(4-methoxiphenyl)-3-phenyl-4,5-dihydro-1H-pyrazole ligand. A dimeric self-assembling via hydrogen bonding was determined by analyzing the short contacts present in the solid-state structure by means of X-ray crystallography. The spectroscopic properties were determined using UV-Vis and fluorescence experiments and an interesting behavior as bluish luminescence was assigned mainly to the mixed (MLCT + IL) electronic transitions of the Cu(I)d10 ® (S=C–Nligand) type. The complete characterization of the new copper (I) complex also included elemental analyses and IR spectroscopy. DOI: http://dx.doi.org/10.17807/orbital.v9i1.952
- Subjects :
- Hydrogen bond
Ligand
Materials Science (miscellaneous)
General Chemical Engineering
Science
chemistry.chemical_element
Infrared spectroscopy
x-ray difractometry
General Chemistry
Copper
Fluorescence
Characterization (materials science)
Crystallography
Chemistry
copper (i) complex
chemistry
Atomic electron transition
luminescent materials
Luminescence
QD1-999
Subjects
Details
- Language :
- English
- ISSN :
- 19846428
- Volume :
- 9
- Issue :
- 1
- Database :
- OpenAIRE
- Journal :
- Orbital: The Electronic Journal of Chemistry
- Accession number :
- edsair.doi.dedup.....9153338e584a3aa165577792b8142c9d