Back to Search
Start Over
Resistive RAM variability monitoring using a ring oscillator based test chip
- Source :
- Microelectronics Reliability, Microelectronics Reliability, Elsevier, 2016, 64 (SI), pp.59-62. ⟨10.1016/j.microrel.2016.07.097⟩, 27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2016), 27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2016), Sep 2016, Halle, Germany, Microelectronics Reliability, 2016, 64 (SI), pp.59-62. ⟨10.1016/j.microrel.2016.07.097⟩
- Publication Year :
- 2016
- Publisher :
- HAL CCSD, 2016.
-
Abstract
- 27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF), Halle, GERMANY, SEP 19-22, 2016; International audience; Common problems with Oxide-based Resistive Random Access Memory (so-called OxRRAM) are related to high variability in operating conditions and low yield. Although research has taken steps to resolve these issues, variability remains an important characteristic for OxRRAMs. In this paper, a test structure consisting of an OxRRAM matrix where each memory cell can be configured as a ring oscillator is introduced. The oscillation frequency of each memory cell is function of the cell resistance. Thus, the test structure provides within-die accurate information regarding OxRRAM cells variability. The test structure can be used as a powerful tool for process variability monitoring during a new process technology introduction but also for marginal cells detection during process maturity. (C) 2016 Elsevier Ltd. All rights reserved.
- Subjects :
- Engineering
Oscillation
business.industry
[SPI.NANO] Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics
020208 electrical & electronic engineering
Process (computing)
02 engineering and technology
Function (mathematics)
Ring oscillator
Condensed Matter Physics
Chip
Atomic and Molecular Physics, and Optics
Surfaces, Coatings and Films
Electronic, Optical and Magnetic Materials
Resistive random-access memory
Matrix (mathematics)
Memory cell
0202 electrical engineering, electronic engineering, information engineering
Electronic engineering
020201 artificial intelligence & image processing
Electrical and Electronic Engineering
[SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics
Safety, Risk, Reliability and Quality
business
ComputingMilieux_MISCELLANEOUS
Subjects
Details
- Language :
- English
- ISSN :
- 00262714
- Database :
- OpenAIRE
- Journal :
- Microelectronics Reliability, Microelectronics Reliability, Elsevier, 2016, 64 (SI), pp.59-62. ⟨10.1016/j.microrel.2016.07.097⟩, 27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2016), 27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2016), Sep 2016, Halle, Germany, Microelectronics Reliability, 2016, 64 (SI), pp.59-62. ⟨10.1016/j.microrel.2016.07.097⟩
- Accession number :
- edsair.doi.dedup.....883bfe8c8b81a6babe28d39e846c4bf2
- Full Text :
- https://doi.org/10.1016/j.microrel.2016.07.097⟩