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Resistive RAM variability monitoring using a ring oscillator based test chip

Authors :
Jean-Michel Portal
Hassen Aziza
Institut des Matériaux, de Microélectronique et des Nanosciences de Provence (IM2NP)
Université de Toulon (UTLN)-Centre National de la Recherche Scientifique (CNRS)-Aix Marseille Université (AMU)
Aix Marseille Université (AMU)-Université de Toulon (UTLN)-Centre National de la Recherche Scientifique (CNRS)
Bibliométrie, IM2NP
Source :
Microelectronics Reliability, Microelectronics Reliability, Elsevier, 2016, 64 (SI), pp.59-62. ⟨10.1016/j.microrel.2016.07.097⟩, 27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2016), 27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2016), Sep 2016, Halle, Germany, Microelectronics Reliability, 2016, 64 (SI), pp.59-62. ⟨10.1016/j.microrel.2016.07.097⟩
Publication Year :
2016
Publisher :
HAL CCSD, 2016.

Abstract

27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF), Halle, GERMANY, SEP 19-22, 2016; International audience; Common problems with Oxide-based Resistive Random Access Memory (so-called OxRRAM) are related to high variability in operating conditions and low yield. Although research has taken steps to resolve these issues, variability remains an important characteristic for OxRRAMs. In this paper, a test structure consisting of an OxRRAM matrix where each memory cell can be configured as a ring oscillator is introduced. The oscillation frequency of each memory cell is function of the cell resistance. Thus, the test structure provides within-die accurate information regarding OxRRAM cells variability. The test structure can be used as a powerful tool for process variability monitoring during a new process technology introduction but also for marginal cells detection during process maturity. (C) 2016 Elsevier Ltd. All rights reserved.

Details

Language :
English
ISSN :
00262714
Database :
OpenAIRE
Journal :
Microelectronics Reliability, Microelectronics Reliability, Elsevier, 2016, 64 (SI), pp.59-62. ⟨10.1016/j.microrel.2016.07.097⟩, 27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2016), 27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2016), Sep 2016, Halle, Germany, Microelectronics Reliability, 2016, 64 (SI), pp.59-62. ⟨10.1016/j.microrel.2016.07.097⟩
Accession number :
edsair.doi.dedup.....883bfe8c8b81a6babe28d39e846c4bf2
Full Text :
https://doi.org/10.1016/j.microrel.2016.07.097⟩