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A micromachined silicon depth probe for multichannel neural recording
- Source :
- IEEE transactions on bio-medical engineering. 47(8)
- Publication Year :
- 2000
-
Abstract
- A process of making a new type of silicon depth-probe microelectrode array is described using a combination of plasma and wet etch. The plasma etch, which is done using a low temperature oxide (LTO) mask, enables probe thickness to be controlled over a range from 5 to 90 /spl mu/. Bending tests show that the probe's mechanical strength depends largely on shank thickness. More force can he applied to thicker shanks while thinner shanks are more flexible. One can then choose a thickness and corresponding mechanical strength using the process developed. The entire probe shaping process is performed only at low temperature, and thus is consistent with the standard CMOS fabrication. Using the probe in recording from rat's somatosensory cortex, the authors obtained four channel simultaneous recordings which showed clear independence among channels with a signal-to-noise ratio performance comparable with that obtained using other devices.
- Subjects :
- Neurons
Silicon
Materials science
Plasma etching
business.industry
Oxide
Biomedical Engineering
chemistry.chemical_element
Plasma
Multielectrode array
Bending
Equipment Design
Somatosensory Cortex
Rats
Rats, Sprague-Dawley
Microelectrode
Surface micromachining
chemistry.chemical_compound
chemistry
Optoelectronics
Animals
business
Microelectrodes
Biomedical engineering
Subjects
Details
- ISSN :
- 00189294
- Volume :
- 47
- Issue :
- 8
- Database :
- OpenAIRE
- Journal :
- IEEE transactions on bio-medical engineering
- Accession number :
- edsair.doi.dedup.....83e6e1638848b12c3bfe8a15bec11bad