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Effect of Electromigration and Thermal Ageing on the Tin Whiskers’ Formation in Thin Sn–0.7Cu–0.05Ga Lead (Pb)-Free Solder Joints
- Source :
- Coatings, Vol 11, Iss 935, p 935 (2021), Coatings, Volume 11, Issue 8
- Publication Year :
- 2021
- Publisher :
- MDPI AG, 2021.
-
Abstract
- The investigation on tin (Sn) whiskers formation has been widely applied in the field of lead-free electronic packaging. This is due to the fact that use of the Sn–Pb finishes has converted to Pb-free finishes in the electronic industry. Sn whiskers can grow long enough to cause a short circuit, which affects electronic devices’ reliability. This study investigates Sn whiskers’ formation in the thin Sn–0.7Cu–0.05Ga Pb-free solder under the influence of electromigration and thermal ageing for surface finish applications. The samples were stored in ambient conditions for 1000 h before being exposed to electromigration and thermal ageing to study the corresponding whiskers’ growth. A scanning electron microscope (SEM) was used to study the Sn whiskers’ microstructure, while an optical microscope (OM) was utilized to investigate the IMC layers in the samples. The results show that the addition of 0.05 wt.% gallium (Ga) decreased the Sn whisker’s length and growth density while simultaneously refining the IMC layers. Synchrotron micro-XRF (µ-XRF) shows the existence and distribution of Ga addition in both electromigration and thermal ageing samples. The shear test was used to determine the solder alloys’ mechanical properties. As a result, the addition of Ga to the Sn–0.7Cu solder improved the fracture morphology of solder joints. In conclusion, Ga’s addition resulted in decreasing Sn whisker formation and refining of the IMCs while also increasing the shear strength of the Sn–0.7Cu solder by ~14%.
- Subjects :
- Materials science
Scanning electron microscope
Whiskers
chemistry.chemical_element
02 engineering and technology
01 natural sciences
Electromigration
law.invention
electromigration
Optical microscope
law
Whisker
0103 physical sciences
Materials Chemistry
Composite material
010302 applied physics
gallium
thermal ageing
tin whiskers
synchrotron micro-XRF
Surfaces and Interfaces
021001 nanoscience & nanotechnology
Microstructure
Engineering (General). Civil engineering (General)
Surfaces, Coatings and Films
chemistry
Soldering
TA1-2040
0210 nano-technology
Tin
intermetallic compound
Subjects
Details
- Language :
- English
- ISSN :
- 20796412
- Volume :
- 11
- Issue :
- 935
- Database :
- OpenAIRE
- Journal :
- Coatings
- Accession number :
- edsair.doi.dedup.....83afbd217d8addc322503e579894494e