Nucleation of tin on the Cu6Sn5 layer in electronic interconnections

MLA

Christopher M. Gourlay, et al. Nucleation of Tin on the Cu6Sn5 Layer in Electronic Interconnections. Oct. 2016. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi.dedup.....836669474373b2f43a6b2e7df1bd7e44&authtype=sso&custid=ns315887.

APA

Christopher M. Gourlay, S.A. Belyakov, Z.L. Ma, J.W. Xian, & Maelig Ollivier. (2016). Nucleation of tin on the Cu6Sn5 layer in electronic interconnections.

Chicago

Christopher M. Gourlay, S.A. Belyakov, Z.L. Ma, J.W. Xian, and Maelig Ollivier. 2016. “Nucleation of Tin on the Cu6Sn5 Layer in Electronic Interconnections,” October. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi.dedup.....836669474373b2f43a6b2e7df1bd7e44&authtype=sso&custid=ns315887.