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Using infrared thermal responses for PCBA production tests: Feasibility study
- Source :
- 30 th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2019), 30 th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2019), Sep 2019, Toulouse, France
- Publication Year :
- 2019
- Publisher :
- HAL CCSD, 2019.
-
Abstract
- International audience; A Printed Circuit Board assembly (PCBA) testing approach using infrared thermal signatures is presented. The concept of thermal signature for PCBAs is introduced and proved by experience and simulation. Based on this concept, the testing method is able to detect assembly defects such as presence of the component, polarity, value and solder (shorts and opens) and in some cases component health state, it also can classify the components mounted on the PCB into two classes (fault-free, faulty). According to the thermal signature of each component on the PCBA, they can be also classified in the same classes. In this article focus is put on capacitor defects in a DC/DC converter, especially capacitor value defects. Therefore, they will be the main tested components. For a robust detection of multiple defect scenarios, the Principal Component Analysis (PCA) method is used as an outlier detection algorithm.
- Subjects :
- Computer science
defect detection
thermal signatures
02 engineering and technology
Hardware_PERFORMANCEANDRELIABILITY
01 natural sciences
law.invention
Printed circuit board
thermal modeling
law
Component (UML)
0103 physical sciences
0202 electrical engineering, electronic engineering, information engineering
Electronic engineering
Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality
Polarity (mutual inductance)
Testability
010302 applied physics
Principal Component Analysis
020208 electrical & electronic engineering
contactless testing
Condensed Matter Physics
Accessibility
Atomic and Molecular Physics, and Optics
Surfaces, Coatings and Films
Electronic, Optical and Magnetic Materials
[SPI.TRON]Engineering Sciences [physics]/Electronics
Capacitor
Principal component analysis
PCBA testing
Anomaly detection
Focus (optics)
Subjects
Details
- Language :
- English
- Database :
- OpenAIRE
- Journal :
- 30 th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2019), 30 th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2019), Sep 2019, Toulouse, France
- Accession number :
- edsair.doi.dedup.....7ded87fc8ce58be9e4561270cf287c08