A 3D wideband package solution using MCM-D BCB technology for tile TR module

MLA

F. Mazel, et al. A 3D Wideband Package Solution Using MCM-D BCB Technology for Tile TR Module. Oct. 2005. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi.dedup.....7b9aa8da62961cae33570b1e260f77b9&authtype=sso&custid=ns315887.

APA

F. Mazel, P. Monfraix, B. Reig, & T. Barbier. (2005). A 3D wideband package solution using MCM-D BCB technology for tile TR module.

Chicago

F. Mazel, P. Monfraix, B. Reig, and T. Barbier. 2005. “A 3D Wideband Package Solution Using MCM-D BCB Technology for Tile TR Module,” October. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi.dedup.....7b9aa8da62961cae33570b1e260f77b9&authtype=sso&custid=ns315887.