Topological Optimization of Microstructure of Adhesives under Thermal and Mechanical Loads

MLA

K. S. Bodyagina, and S. P. Pavlov. “Topological Optimization of Microstructure of Adhesives under Thermal and Mechanical Loads.” Matematika i Matematičeskoe Modelirovanie, no. 2, July 2019, pp. 1–28. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi.dedup.....71668b30080d965a44563d070defa2a4&authtype=sso&custid=ns315887.

APA

K. S. Bodyagina, & S. P. Pavlov. (2019). Topological Optimization of Microstructure of Adhesives under Thermal and Mechanical Loads. Matematika i Matematičeskoe Modelirovanie, 2, 1–28.

Chicago

K. S. Bodyagina, and S. P. Pavlov. 2019. “Topological Optimization of Microstructure of Adhesives under Thermal and Mechanical Loads.” Matematika i Matematičeskoe Modelirovanie, no. 2 (July): 1–28. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi.dedup.....71668b30080d965a44563d070defa2a4&authtype=sso&custid=ns315887.