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Redistribution of phosphorus during NiPtSi formation on in-situ doped Si

Authors :
M. Lemang
Ph. Rodriguez
Magali Gregoire
Marc Juhel
Patrice Gergaud
B. Saidi
Dominique Mangelinck
Fabrice Nemouchi
STMicroelectronics
Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information (CEA-LETI)
Direction de Recherche Technologique (CEA) (DRT (CEA))
Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA)
STMicroelectronics [Crolles] (ST-CROLLES)
Institut des Matériaux, de Microélectronique et des Nanosciences de Provence (IM2NP)
Université de Toulon (UTLN)-Centre National de la Recherche Scientifique (CNRS)-Aix Marseille Université (AMU)
Aix Marseille Université (AMU)-Université de Toulon (UTLN)-Centre National de la Recherche Scientifique (CNRS)
Source :
Microelectronic Engineering, Microelectronic Engineering, Elsevier, 2018, 202, pp.25-30. ⟨10.1016/j.mee.2018.10.005⟩, Microelectronic Engineering, 2018, 202, pp.25-30. ⟨10.1016/j.mee.2018.10.005⟩
Publication Year :
2018
Publisher :
HAL CCSD, 2018.

Abstract

This study focuses on silicide formation on phosphorus in-situ doped samples, the phosphorus diffusion and its distribution during the solid-state reaction. The silicidation is achieved with a 16 nm thin film of Ni0.9Pt0.1 followed by a two steps annealing process using rapid thermal annealing, selective etching and dynamic surface annealing. Silicide formation is investigated thanks to in-situ X-ray diffraction and X-ray reflectivity, while the phosphorus concentration profiles after silicidation are obtained by Time-of-Flight Secondary Ion Mass Spectroscopy. Based on these profiles, simulation of the phosphorus redistribution is achieved. The latter is linked to a fast diffusion in the silicide and at its grain boundaries. This feature is put forward to explain how doping may influence the phase sequence of silicide formation.

Details

Language :
English
ISSN :
01679317 and 18735568
Database :
OpenAIRE
Journal :
Microelectronic Engineering, Microelectronic Engineering, Elsevier, 2018, 202, pp.25-30. ⟨10.1016/j.mee.2018.10.005⟩, Microelectronic Engineering, 2018, 202, pp.25-30. ⟨10.1016/j.mee.2018.10.005⟩
Accession number :
edsair.doi.dedup.....70ad06bd5b14638723092c488ee4c283
Full Text :
https://doi.org/10.1016/j.mee.2018.10.005⟩