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High speed thermal mapping on six-pack SiC-based module for hybrid and electric vehicles
- Source :
- 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
- Publisher :
- IEEE
Details
- Language :
- English
- ISBN :
- 978-1-66545-836-8
- ISBNs :
- 9781665458368
- Database :
- OpenAIRE
- Journal :
- 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
- Accession number :
- edsair.doi.dedup.....6ece5df3b7c74bc20706b8ea1aef8f20
- Full Text :
- https://doi.org/10.1109/eurosime54907.2022.9758858