Oxide and nitride formation and segregation of metals during oxygen and nitrogen bombardment of silicon

This study compares oxide and nitride formation during oxygen and nitrogen bombardment of Si. Ion bombardment is carried out both in a SIMS machine and in a conventional implanter at various temperatures. Stoichiometric SiO2 and slightly N-rich Si3N4 are formed during bombardment even at cryogenic temperatures. Implanted metals were found to have a strong tendency to be segregated at a moving Si-SiO2 interface during oxygen bombardment but little segregation is observed at a Si-Si3N4 interface.