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4H-SiC(0001) Surface Faceting during Interaction with Liquid Si

Authors :
Gabriel Ferro
Olivier Dezellus
V. Souliere
Judith Woerle
Davy Carole
Ulrike Grossner
Massimo Camarda
Laboratoire des Multimatériaux et Interfaces (LMI)
Université Claude Bernard Lyon 1 (UCBL)
Université de Lyon-Université de Lyon-Institut de Chimie du CNRS (INC)-Centre National de la Recherche Scientifique (CNRS)
Laboratory for Micro- and Nanotechnology, Paul Scherrer Institut
Paul Scherrer Institute (PSI)
Physics Department (ETHZ)
Eidgenössische Technische Hochschule - Swiss Federal Institute of Technology [Zürich] (ETH Zürich)
Roccaforte, Fabrizio
La Via, Francesco
Nipoti, Roberta
Crippa, Danilo
Giannazzo, Filippo
Saggio, Mario
Source :
Materials Science Forum, Materials Science Forum, Trans Tech Publications Inc., 2016, 858, pp.163-166. ⟨10.4028/www.scientific.net/MSF.858.163⟩, Materials Science Forum, 858, Silicon Carbide and Related Materials 2015
Publication Year :
2016
Publisher :
HAL CCSD, 2016.

Abstract

The aim of this study was to find conditions allowing the "natural" formation of a regular and controllable step bunched morphology on a 4H-SiC seed without the need of any SiC deposition. This was performed by melting a bulk piece of Si on a 4°off 4H seed in the temperature range of 1500 - 1600°C, for 15 min. After etching the remaining Si, the 4H surface was found to be successfully highly step bunched with steps very parallel and regular. A mechanism of dissolution-precipitation was proposed, which could occur both on a short (step to step) and long (centre to periphery) range. This process is kinetically limited at low temperature (1500-1550°C) and considered to be close to the equilibrium at 1600°C.<br />Materials Science Forum, 858<br />ISSN:0255-5476<br />ISSN:1662-9752<br />Silicon Carbide and Related Materials 2015<br />ISBN:978-3-0357-1042-7<br />ISBN:3-0357-1042-2

Details

Language :
English
ISBN :
978-3-0357-1042-7
3-0357-1042-2
ISSN :
02555476, 16629752, and 16629760
ISBNs :
9783035710427 and 3035710422
Database :
OpenAIRE
Journal :
Materials Science Forum, Materials Science Forum, Trans Tech Publications Inc., 2016, 858, pp.163-166. ⟨10.4028/www.scientific.net/MSF.858.163⟩, Materials Science Forum, 858, Silicon Carbide and Related Materials 2015
Accession number :
edsair.doi.dedup.....65cdf2380a27c0b5545c635e33c26648