Wafer level manufacturing of photonic biosensors with integrated active components

In this paper, the developments achieved in PHOTO-SENS* towards a process for the wafer level manufacturing of hybrid photonic biosensor PICs are outlined. First, the design and fabrication of the PIC wafers is described, followed by the wafer level hybrid integration of active components (light source, detector, and temperature sensor). Then, wafers are material-selectively coated to enable local biofunctionalization of the sensing waveguides. Singulation of the coated hybrid PICs into individual chips is achieved using stealth dicing. * This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No 965643. See www.photo-sens.eu for more information.
{"references":["M. Chatzipetrou et al., \"A miniature bio-photonics companion diagnostics platform for reliable cancer treatment monitoring in blood fluids,\" Sensors, vol. 21, no. 6, 2021, doi: 10.3390/s21062230","K. Wörhoff, R. G. Heideman, A. Leinse, and M. Hoekman, \"TriPleX: a versatile dielectric photonic platform,\" Adv. Opt. Technol., vol. 4, no. 2, pp. 189–207, 2015, doi: 10.1515/aot-2015-0016","G. Besselink et al., \"Asymmetric Mach–Zehnder Interferometric Biosensing for Quantitative and Sensitive Multiplex Detection of Anti-SARS-CoV-2 Antibodies in Human Plasma,\" Biosensors, vol. 12, no. 8, p. 553, Jul. 2022, doi: 10.3390/bios12080553","W.-S. Lei, A. Kumar, and R. Yalamanchili, \"Die singulation technologies for advanced packaging: A critical review,\" J. Vac. Sci. Technol. B, Nanotechnol. Microelectron. Mater. Process. Meas. Phenom., vol. 30, no. 4, p. 040801, 2012, doi: 10.1116/1.3700230"]}