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Biocompatibility of ferulic/succinic acid-grafted chitosan hydrogels for implantation after brain injury: A preliminary study

Authors :
Juan Carlos Mateos-Díaz
Jorge Matías-Guiu
Ulises Gómez-Pinedo
Hugo Espinosa-Andrews
Mercedes A. Hernández-Sapiéns
Doddy Denise Ojeda-Hernández
Yolanda González-García
Alejandro A. Canales-Aguirre
Source :
Materials scienceengineering. C, Materials for biological applications. 121
Publication Year :
2020

Abstract

Nowadays it is known that neural cells are capable of regenerating after brain injury, but their success highly depends on the local environment, including the presence of a biological structure to support cell proliferation and restore the lost tissue. Different chitosan-based biomaterials have been employed in response to this necessity. We hypothesized that hydrogels made of antioxidant compounds functionalizing chitosan could provide a suitable environment to home new cells and offer a way to achieve brain repair. In this work, the implantation of functionalized chitosan biomaterials in a brain injury animal model was evaluated. The injury consisted of mechanical damage applied to the cerebral cortex of Wistar rats followed by the implantation of four different chitosan-based biomaterials. After 15 and 30 days, animals underwent magnetic resonance imaging, then they were sacrificed, and the brain tissue was analyzed by immunohistochemistry. The proliferation of microglia and astrocytes increased at the lesion zone, showing differences between the evaluated biomaterials. Also, cell nuclei were seen inside the biomaterials, indicating cell migration and biodegradation. Chitosan-based hydrogels are able to fill in the tissue cavity and bare cells for the endogenous restoration process. The addition of ferulic and succinic acid to the chitosan structure increases this capacity and decreases the inflammatory reaction to the implant.

Details

ISSN :
18730191
Volume :
121
Database :
OpenAIRE
Journal :
Materials scienceengineering. C, Materials for biological applications
Accession number :
edsair.doi.dedup.....5f5050f64d0220fbfff548f6d45e6b8c