Thermomechanical Behaviour of a PWB by Speckle Interferometry Technique

The speckle interferometry technique has been used in this work in order to determine the thermomechanical behaviour of Printed Wiring Board (PWB) (circuits) of a radio integrated with tape player and speakers. A preliminary experiment of such technique has been carried out on a single electronic component (silicon transistor), during the thermal transient and at the steady state. The thermal deformation and stresses on PWB have been obtained through related experimental analyses on both cases. The results showed a very good applicability of speckle technique on the irregular object surface as PWB.