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Physical Study of SiC Power MOSFETs Towards HTRB Stress Based on C-V Characteristics
- Source :
- IEEE Transactions on Device and Materials Reliability, IEEE Transactions on Device and Materials Reliability, 2020, 20 (3), pp.506-511. ⟨10.1109/TDMR.2020.2999029⟩, IEEE Transactions on Device and Materials Reliability, Institute of Electrical and Electronics Engineers, In press, pp.1-1. ⟨10.1109/TDMR.2020.2999029⟩, IEEE Transactions on Device and Materials Reliability, Institute of Electrical and Electronics Engineers, 2020, 20 (3), pp.506-511. ⟨10.1109/TDMR.2020.2999029⟩
- Publication Year :
- 2020
- Publisher :
- HAL CCSD, 2020.
-
Abstract
- The quality of the gate-oxide and Oxide/SiC interfaces is one of the crucial issues in the implementation of silicon carbide (SiC) Metal Oxide Semiconductor Field Effect Transistors (MOSFETs) in the industrial power electronic applications. The main goal of this work is to investigate the gate-oxide integrity and to understand the basic phenomena involved on 4H-SiC MOSFET by the mean of Capacitance-Voltage (C-V) characterizations. The paper presents HTRB (High Temperature Reverse Bias) test results on the second and third generations of SiC MOSFETs. The C-V measurements are compared to physical simulation results. The good agreement between 2D numerical simulations and measurements suggests failures related to acceptor interface traps and doping concentration variations.
- Subjects :
- 010302 applied physics
[PHYS]Physics [physics]
Materials science
Doping
01 natural sciences
Acceptor
Capacitance
Engineering physics
Electronic, Optical and Magnetic Materials
chemistry.chemical_compound
[SPI]Engineering Sciences [physics]
chemistry
Logic gate
0103 physical sciences
MOSFET
Silicon carbide
Field-effect transistor
Electrical and Electronic Engineering
Power MOSFET
Safety, Risk, Reliability and Quality
ComputingMilieux_MISCELLANEOUS
Subjects
Details
- Language :
- English
- ISSN :
- 15304388
- Database :
- OpenAIRE
- Journal :
- IEEE Transactions on Device and Materials Reliability, IEEE Transactions on Device and Materials Reliability, 2020, 20 (3), pp.506-511. ⟨10.1109/TDMR.2020.2999029⟩, IEEE Transactions on Device and Materials Reliability, Institute of Electrical and Electronics Engineers, In press, pp.1-1. ⟨10.1109/TDMR.2020.2999029⟩, IEEE Transactions on Device and Materials Reliability, Institute of Electrical and Electronics Engineers, 2020, 20 (3), pp.506-511. ⟨10.1109/TDMR.2020.2999029⟩
- Accession number :
- edsair.doi.dedup.....5dbe3b5addf973656313632a36d0aedb
- Full Text :
- https://doi.org/10.1109/TDMR.2020.2999029⟩