A RF Redundant TSV Interconnection for High Resistance Si Interposer

MLA

Liulin Hu, et al. “A RF Redundant TSV Interconnection for High Resistance Si Interposer.” Micromachines, vol. 12, no. 169, Feb. 2021. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi.dedup.....56753fdb808c8e01acf9cf554d96f2b4&authtype=sso&custid=ns315887.

APA

Liulin Hu, Shenglin Ma, Wei Wang, Yufeng Jin, Shuwei He, Mengcheng Wang, & Jing Chen. (2021). A RF Redundant TSV Interconnection for High Resistance Si Interposer. Micromachines, 12(169).

Chicago

Liulin Hu, Shenglin Ma, Wei Wang, Yufeng Jin, Shuwei He, Mengcheng Wang, and Jing Chen. 2021. “A RF Redundant TSV Interconnection for High Resistance Si Interposer.” Micromachines 12 (169). http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi.dedup.....56753fdb808c8e01acf9cf554d96f2b4&authtype=sso&custid=ns315887.