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Coating 1-Octanethiol-Coated Copper Nano-Ink on a Paper Substrate via Multi-Pulse Flash Light Sintering for Application in Disposable Devices
- Source :
- Electronic Materials, Volume 1, Issue 1, Pages 4-39
- Publication Year :
- 2020
- Publisher :
- MDPI AG, 2020.
-
Abstract
- Inkjet-printed patterns were formed on a paper substrate using anti-oxidant copper nano-ink for application to disposable electronic devices. To prevent substrate damage, the pattern was flash light sintered under ambient conditions using the multi-pulse technique. Pure copper nanoparticles were coated with 1-octanethiol for oxidation resistance using the dry-coating method. Mixing these with 1-octanol solvent at a concentration of 30 wt% produced the copper nano-ink. Photo paper was used as the substrate. The contact angle between the photo paper and copper nano-ink was 37.2&deg<br />and the optimal energy density for the multi-pulse flash light sintering technique was 15.6 J/cm2. Using this energy density, the optimal conditions were an on-time of 2 ms (duty cycle of 80%) for three pulses. The resistivity of the resulting pattern was 2.8 &times<br />10&minus<br />7 &Omega<br />∙m. After bending 500 times to a radius of curvature of 30 mm, the relative resistance (&Delta<br />R/R0) of the multi-pulse flash light-sintered pattern hardly changed compared to that of the unbent pattern, while the single-pulse-sintered pattern showed dramatic increase by 8-fold compared to the unbent pattern. Therefore, the multi-pulse light sintering technique is a promising approach to produce an inkjet-printed pattern that can be applied to disposable electronic devices.
- Subjects :
- inkjet printing
Materials science
copper nanoparticles
chemistry.chemical_element
Sintering
Nanoparticle
Substrate (electronics)
engineering.material
Copper
Contact angle
Flash (photography)
Coating
chemistry
Electrical resistivity and conductivity
engineering
anti-oxidation
Composite material
flash light sintering
1-octanethiol
Subjects
Details
- ISSN :
- 26733978
- Volume :
- 1
- Database :
- OpenAIRE
- Journal :
- Electronic Materials
- Accession number :
- edsair.doi.dedup.....5645a08399cf49496a1832c10cd3409d