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Development and adhesion characterization of a silicon wafer for temporary bonding
- Source :
- International Journal of Adhesion and Adhesives, International Journal of Adhesion and Adhesives, Elsevier, 2018, 82, pp.100-107. ⟨10.1016/j.ijadhadh.2018.01.007⟩, International Journal of Adhesion and Adhesives, 2018, 82, pp.100-107. ⟨10.1016/j.ijadhadh.2018.01.007⟩
- Publication Year :
- 2018
- Publisher :
- Elsevier BV, 2018.
-
Abstract
- International audience; The development of a silicon temporary carrier for thin wafer handling for 3D applications was investigated. Process selection and optimization ended up with a silicon carrier entirely covered with an antistick layer based on a fluorinated polymer. The carrier preparation was quite easy because only one coating was used and no sticking edge zone was needed onto the carrier. The fluorinated coating led to a very hydrophobic behavior. When bonded with a thermoplastic glue, it also exhibited very antiadhesive properties because the adherence was as low as 0.4 J/m(2) and lower than the adherence of a stack without any antiadhesive layer (above 4 J/m(2)). The carrier was nevertheless suitable for different back side processes in 300 mm grinding, chemical cleaning, chemical mechanical polishing and silicon oxide deposition. Compared with a commercial carrier, it exhibited the same level of performance for the integration. The proposed carrier was compatible with a mechanical debonding of a thinned bonded structure with a silicon device wafer of 80 pm. The carrier recycling was possible without any new preparation.
- Subjects :
- 010302 applied physics
chemistry.chemical_classification
Thermoplastic
Materials science
Polymers and Plastics
Silicon
General Chemical Engineering
chemistry.chemical_element
02 engineering and technology
engineering.material
021001 nanoscience & nanotechnology
01 natural sciences
Biomaterials
[SPI]Engineering Sciences [physics]
chemistry
Coating
Chemical-mechanical planarization
0103 physical sciences
engineering
Wafer
Adhesive
Composite material
0210 nano-technology
Silicon oxide
Layer (electronics)
Subjects
Details
- ISSN :
- 01437496
- Volume :
- 82
- Database :
- OpenAIRE
- Journal :
- International Journal of Adhesion and Adhesives
- Accession number :
- edsair.doi.dedup.....5580a8b9879d5fab11cfa1ff4c51febd