Metal to glass anodic bonding for microsystems packaging

Authors :: P. Weber
N. F. de Rooij
Danick Briand
Source :: TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664).
Publication Year :: 2004
Publisher :: IEEE, 2004.
Abstract: In this communication, we report on metal to glass anodic bonding for Microsystems packaging. Bonded Pyrex-Foturan/Metal double stack and Silicon/Pyrex/Metal triple stack were investigated for applications in the sensor encapsulation field. Anodic bonding of metals, sheets of Invar, Kovar, Alloy 42 and Titanium, and thin films of Titanium, to Ion-containing glasses with two different thermal expansion coefficients, Pyrex and Foturan, was evaluated in terms of samples preparation, bonding parameters, and bonding characteristics. Selected metals anodically bonded to glass exhibited levels of residual stress, strength and tightness that make this technique suitable for packaging Microsystems, silicon piezoresistive sensors and micro-fluidic systems, among others.

Subjects :: Materials science
Silicon
Metallurgy
Alloy
chemistry.chemical_element
engineering.material
Piezoresistive effect
chemistry
Residual stress
Anodic bonding
engineering
Kovar
Invar
Titanium

Database :: OpenAIRE
Journal :: TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664)
Accession number :: edsair.doi.dedup.....53cf0e8a5f17332f13bb8e54957c703f
Full Text :: https://doi.org/10.1109/sensor.2003.1217142