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Instant tough bonding of hydrogels for soft machines and electronics
- Source :
- Science Advances
- Publication Year :
- 2017
-
Abstract
- A strategy for bonding water-rich hydrogels to diverse materials for electronic skins, energy storage, and soft optics is reported.<br />Introducing methods for instant tough bonding between hydrogels and antagonistic materials—from soft to hard—allows us to demonstrate elastic yet tough biomimetic devices and machines with a high level of complexity. Tough hydrogels strongly attach, within seconds, to plastics, elastomers, leather, bone, and metals, reaching unprecedented interfacial toughness exceeding 2000 J/m2. Healing of severed ionic hydrogel conductors becomes feasible and restores function instantly. Soft, transparent multilayered hybrids of elastomers and ionic hydrogels endure biaxial strain with more than 2000% increase in area, facilitating soft transducers, generators, and adaptive lenses. We demonstrate soft electronic devices, from stretchable batteries, self-powered compliant circuits, and autonomous electronic skin for triggered drug delivery. Our approach is applicable in rapid prototyping and in delicate environments inaccessible for extended curing and cross-linking.
- Subjects :
- Rapid prototyping
energy harvesting
Materials science
stretchable electronics
Stretchable electronics
Electronic Skins
Electronic skin
Nanotechnology
02 engineering and technology
010402 general chemistry
Elastomer
01 natural sciences
complex mixtures
Engineering
Soft Robots
Electronics
Research Articles
hydrogels
Soft Electronics
Soft Batteries
Multidisciplinary
integumentary system
Interfacial toughness
technology, industry, and agriculture
SciAdv r-articles
respiratory system
021001 nanoscience & nanotechnology
0104 chemical sciences
Biomimetic Devices
Self-healing hydrogels
Adaptive Optics
0210 nano-technology
human activities
Research Article
Subjects
Details
- ISSN :
- 23752548
- Volume :
- 3
- Issue :
- 6
- Database :
- OpenAIRE
- Journal :
- Science advances
- Accession number :
- edsair.doi.dedup.....52cac8a3770601031c9548828553b152