Back to Search Start Over

Hard Copper with Good Electrical Conductivity Fabricated by Accumulative Roll-Bonding to Ultrahigh Strains

Authors :
Q.S. Mei
Li Congling
Chen Feng
Zhang Guodong
Bing Yang
Gongcheng Yao
Ma Ye
Li Juying
Source :
Metals, Vol 6, Iss 5, p 115 (2016), Metals; Volume 6; Issue 5; Pages: 115
Publication Year :
2016
Publisher :
MDPI AG, 2016.

Abstract

By modifying the accumulative roll-bonding (ARB) procedures, accumulative roll-bonding (ARB) processing up to 30 cycles (N) with a 50% thickness reduction per cycle (equivalent strain = 24) at room temperature was conducted on pure copper. The bonding condition, microhardness and electrical conductivity of the ARBed Cu were studied. Results showed that good bonding condition of the samples was achieved. As N increases, the microhardness of ARBed Cu increases, reaching ~2.9 times that of annealed Cu for N = 30. The electrical conductivity of ARBed Cu decreases slightly but with periodic fluctuations for N > 10, with a minimum of 90.4% IACS for N = 30. Our study indicated that ARB can be an effective way to produce high-hardness and high-conductivity pure copper better than or comparable to Cu alloys and Cu based composites as reported.

Details

ISSN :
20754701
Volume :
6
Database :
OpenAIRE
Journal :
Metals
Accession number :
edsair.doi.dedup.....5014ad49f6b6b3b180a1c316842a1430
Full Text :
https://doi.org/10.3390/met6050115