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Performance Evaluation of Silicon Based Thermoelectric Generators Interest of Coupling Low Thermal Conductivity Thin Films and a Planar Architecture

Authors :
Thierno-Moussa Bah
Stanjen Didenko
Emmanuel Dubois
Jean-François Robillard
Thomas Skotnicki
Stephane Monfray
Institut d’Électronique, de Microélectronique et de Nanotechnologie - UMR 8520 (IEMN)
Centrale Lille-Institut supérieur de l'électronique et du numérique (ISEN)-Université de Valenciennes et du Hainaut-Cambrésis (UVHC)-Université de Lille-Centre National de la Recherche Scientifique (CNRS)-Université Polytechnique Hauts-de-France (UPHF)
STMicroelectronics [Crolles] (ST-CROLLES)
Microélectronique Silicium - IEMN (MICROELEC SI - IEMN)
Centrale Lille-Institut supérieur de l'électronique et du numérique (ISEN)-Université de Valenciennes et du Hainaut-Cambrésis (UVHC)-Université de Lille-Centre National de la Recherche Scientifique (CNRS)-Université Polytechnique Hauts-de-France (UPHF)-Centrale Lille-Institut supérieur de l'électronique et du numérique (ISEN)-Université de Valenciennes et du Hainaut-Cambrésis (UVHC)-Université de Lille-Centre National de la Recherche Scientifique (CNRS)-Université Polytechnique Hauts-de-France (UPHF)
Renatech Network
Laboratoire commun STMicroelectronics-IEMN T4
European Project: 338179,EC:FP7:ERC,ERC-2013-StG,UPTEG(2013)
Microélectronique Silicium - IEMN (MICROE SI - IEMN)
Source :
ESSDERC, Proceedings of European Solid State Device Research Conference ESSDERC’2018, Dresden, 3-6 Sep. (2018), 48th European Solid-State Device Research Conference (ESSDERC 2018), 48th European Solid-State Device Research Conference (ESSDERC 2018), Sep 2018, Dresden, Germany. pp.226-229, ⟨10.1109/ESSDERC.2018.8486919⟩
Publication Year :
2018
Publisher :
IEEE, 2018.

Abstract

International audience; This study aims to compare a silicon ThermoElectric Generator design (TEG) with a commercial TEG made of BiTe alloy commercialized till recently by Micropelt. The objective is to show that recent advances in heat conduction modulation by silicon planar nanostructures may potentially improve thermoelectric performance of silicon to a competitive level with respect to conventional materials. To that end a planar converter architecture is proposed and modeled by Finite Elements Method and an analytical model based on thermal conductivities reported in the literature. Results show the absence or with a small capacity heat sink. This opens the way to the proposal of TEG based on Si material and compatible with mass production facilities of semiconductor manufacturers.

Details

Database :
OpenAIRE
Journal :
2018 48th European Solid-State Device Research Conference (ESSDERC)
Accession number :
edsair.doi.dedup.....47a12bba748b6f2464a9963d08354387
Full Text :
https://doi.org/10.1109/essderc.2018.8486919