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Printed hybrid systems
- Source :
- Karioja, P, Mäkinen, J-T, Keränen, K, Aikio, J, Alajoki, T, Jaakola, T, Koponen, M, Keränen, A, Heikkinen, M, Tuomikoski, M, Suhonen, R, Hakalahti, L, Kopola, P, Hast, J, Liedert, R, Hiltunen, J, Masuda, N, Kemppainen, A, Rönkä, K & Korhonen, R 2012, Printed hybrid systems . in V K Varadan (ed.), Proceedings of SPIE : Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2012 ., 83440G, International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 8344, SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, San Diego, California, United States, 11/03/12 . https://doi.org/10.1117/12.915206
- Publication Year :
- 2012
- Publisher :
- International Society for Optics and Photonics SPIE, 2012.
-
Abstract
- This paper presents research activities carried out at VTT Technical Research Centre of Finland in the field of hybrid integration of optics, electronics and mechanics. Main focus area in our research is the manufacturing of electronic modules and product structures with printed electronics, film-over-molding and polymer sheet lamination technologies and the goal is in the next generation of smart systems utilizing monolithic polymer packages. The combination of manufacturing technologies such as roll-to-roll -printing, injection molding and traditional component assembly is called Printed Hybrid Systems (PHS). Several demonstrator structures have been made, which show the potential of polymer packaging technology. One demonstrator example is a laminated structure with embedded LED chips. Element thickness is only 0.3mm and the flexible stack of foils can be bent in two directions after assembly process and was shaped curved using heat and pressure. The combination of printed flexible circuit boards and injection molding has also been demonstrated with several functional modules. The demonstrators illustrate the potential of origami electronics, which can be cut and folded to 3D shapes. It shows that several manufacturing process steps can be eliminated by Printed Hybrid Systems technology. The main benefits of this combination are small size, ruggedness and conformality. The devices are ideally suited for medical applications as the sensitive electronic components are well protected inside the plastic and the structures can be cleaned easily due to the fact that they have no joints or seams that can accumulate dirt or bacteria.
- Subjects :
- Computer science
over-molding
Mechanical engineering
Nanotechnology
Molding (process)
law.invention
Printed circuit board
embedding
smart system integration
law
multilayer polymer substrate
Lamination
Electronics
hot lamination
chemistry.chemical_classification
Packaging engineering
business.industry
Polymer
chemistry
Hybrid system
visual_art
Printed electronics
Electronic component
visual_art.visual_art_medium
printed electronics
business
Subjects
Details
- Language :
- English
- Database :
- OpenAIRE
- Journal :
- Karioja, P, Mäkinen, J-T, Keränen, K, Aikio, J, Alajoki, T, Jaakola, T, Koponen, M, Keränen, A, Heikkinen, M, Tuomikoski, M, Suhonen, R, Hakalahti, L, Kopola, P, Hast, J, Liedert, R, Hiltunen, J, Masuda, N, Kemppainen, A, Rönkä, K & Korhonen, R 2012, Printed hybrid systems . in V K Varadan (ed.), Proceedings of SPIE : Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2012 ., 83440G, International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 8344, SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, San Diego, California, United States, 11/03/12 . https://doi.org/10.1117/12.915206
- Accession number :
- edsair.doi.dedup.....44533e80efb83669844c2d89b5372548