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Thermal Transport in 3D Nanostructures
- Source :
- Advanced Functional Materials. 30:1903841
- Publication Year :
- 2019
- Publisher :
- Wiley, 2019.
-
Abstract
- This work summarizes recent progress on the thermal transport properties of three-dimensional (3D) nanostructures, with an emphasis on experimental results. Depending on the applications, different 3D nanostructures can be prepared or designed to either achieve a low thermal conductivity for thermal insulation or thermoelectric devices, or a high thermal conductivity for thermal interface materials used in the continuing miniaturization of electronics. A broad range of 3D nanostructures have been discussed, ranging from colloidal crystals/assemblies, array structures, holey structures, hierarchical structures, 3D nanostructured fillers for metal matrix composites and polymer composites. Different factors that impact the thermal conductivity of these 3D structures are compared and analyzed. This work provides an overall understanding of the thermal transport properties of various 3D nanostructures, which will shed light on the thermal management at nanoscale.<br />Comment: 30 pages, 23 figures
- Subjects :
- Nanostructure
Materials science
FOS: Physical sciences
Nanotechnology
Applied Physics (physics.app-ph)
02 engineering and technology
010402 general chemistry
01 natural sciences
Biomaterials
Thermal conductivity
Thermal insulation
Mesoscale and Nanoscale Physics (cond-mat.mes-hall)
Thermal
Thermoelectric effect
Electrochemistry
Miniaturization
Nanoscopic scale
Condensed Matter - Materials Science
Condensed Matter - Mesoscale and Nanoscale Physics
business.industry
Materials Science (cond-mat.mtrl-sci)
Physics - Applied Physics
Colloidal crystal
021001 nanoscience & nanotechnology
Condensed Matter Physics
0104 chemical sciences
Electronic, Optical and Magnetic Materials
0210 nano-technology
business
Subjects
Details
- ISSN :
- 16163028 and 1616301X
- Volume :
- 30
- Database :
- OpenAIRE
- Journal :
- Advanced Functional Materials
- Accession number :
- edsair.doi.dedup.....400bfc8fa93aee1096ce5eb520485977