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Fundamental mechanisms of coupling between planar electromagnetic bandgap structures and interconnects in high-speed digital circuits. Part I - microstrip lines

Authors :
F. de Paulis
Antonio Orlandi
L. Raimondo
Giulio Antonini
Source :
2009 International Symposium on Electromagnetic Compatibility - EMC Europe.
Publication Year :
2009
Publisher :
IEEE, 2009.

Abstract

The paper studies the signal integrity performances of a microstripline routed over a planar EBG structure. The fundamental mechanisms of the coupling between the signal transmitted along the trace and the resonant properties of the same structure are investigated.

Details

Database :
OpenAIRE
Journal :
2009 International Symposium on Electromagnetic Compatibility - EMC Europe
Accession number :
edsair.doi.dedup.....3d3921f94bc2c019cf85bce1ebfecb0f
Full Text :
https://doi.org/10.1109/emceurope.2009.5189701