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Fundamental mechanisms of coupling between planar electromagnetic bandgap structures and interconnects in high-speed digital circuits. Part I - microstrip lines
- Source :
- 2009 International Symposium on Electromagnetic Compatibility - EMC Europe.
- Publication Year :
- 2009
- Publisher :
- IEEE, 2009.
-
Abstract
- The paper studies the signal integrity performances of a microstripline routed over a planar EBG structure. The fundamental mechanisms of the coupling between the signal transmitted along the trace and the resonant properties of the same structure are investigated.
Details
- Database :
- OpenAIRE
- Journal :
- 2009 International Symposium on Electromagnetic Compatibility - EMC Europe
- Accession number :
- edsair.doi.dedup.....3d3921f94bc2c019cf85bce1ebfecb0f
- Full Text :
- https://doi.org/10.1109/emceurope.2009.5189701