Thermally stable and soft pressure-sensitive adhesive for foldable electronics

Authors :: TaekSoo Kim
Woosung Jo
Kihoon Jeong
Young-Sam Park
Jeong-Ik Lee
Sung Gap Im
Source :: Chemical Engineering Journal. 452:139050
Publication Year :: 2023
Publisher :: Elsevier BV, 2023.

Subjects :: History
Polymers and Plastics
General Chemical Engineering
Environmental Chemistry
General Chemistry
Business and International Management
Industrial and Manufacturing Engineering

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