Shear banding in sub-microcrystalline nickel at 4K

Authors :: Benoît Beausir
L. Hollang
E. Hieckmann
Werner Skrotzki
Suhash R. Dey
Indian Institute of Technology [Hyderabad] (IIT Hyderabad)
Institut für Strukturphysik
Technische Universität Dresden = Dresden University of Technology (TU Dresden)
Laboratoire d'Etude des Microstructures et de Mécanique des Matériaux (LEM3)
Université de Lorraine (UL)-Centre National de la Recherche Scientifique (CNRS)-Arts et Métiers Sciences et Technologies
HESAM Université (HESAM)-HESAM Université (HESAM)
Institut für Angewandte Photophysik.
Source :: Mechanics of Materials, Mechanics of Materials, Elsevier, 2013, 66, pp.1-6. ⟨10.1016/j.mechmat.2013.05.018⟩
Publication Year :: 2013
Publisher :: Elsevier BV, 2013.
Abstract: International audience; A flat specimen of sub-microcrystalline nickel was tensile tested at 4 K until fracture occurred and subsequently investigated by electron backscatter diffraction in a high resolution scanning electron microscope in order to deduce the local texture in the near crack area. Thus, two sets of intersecting fine slip markings observed on the surface (under +/- 55 degrees with respect to the tensile axis) could be explained as a result of localized simple shear in the bulk material underneath the slip markings. The overall amount of shear in the region near the crack was estimated to be 1.25 based on texture simulations using the viscoplastic self-consistent polycrystal model.