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An investigation of current distribution over four GaN HEMTs in parallel configurations

Authors :
Jean-François Mogniotte
Stephane Azzopardi
Bruno Allard
Charles Joubert
Hervé Morel
Cyril Buttay
Thilini Wickramasinghe
Pascal Bevilacqua
Thanh-Long Le
Christian Martin
Ampère, Département Energie Electrique (EE)
Ampère (AMPERE)
École Centrale de Lyon (ECL)
Université de Lyon-Université de Lyon-Université Claude Bernard Lyon 1 (UCBL)
Université de Lyon-Institut National des Sciences Appliquées de Lyon (INSA Lyon)
Université de Lyon-Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Centre National de la Recherche Scientifique (CNRS)-Institut National de Recherche pour l’Agriculture, l’Alimentation et l’Environnement (INRAE)-École Centrale de Lyon (ECL)
Université de Lyon-Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Centre National de la Recherche Scientifique (CNRS)-Institut National de Recherche pour l’Agriculture, l’Alimentation et l’Environnement (INRAE)
Safran Tech
Source :
The 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA 2019), The 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA 2019), Oct 2019, Raleigh, United States
Publication Year :
2019
Publisher :
IEEE, 2019.

Abstract

International audience; GaN HEMTs are desirable for parallel configurations due to (i) relatively steady threshold voltage over a wide temperature range and (ii) the positive temperature coefficient of their on-resistances. However, their operations are sensitive to the circuit parasitics and dissimilarities between devices. This paper investigates the current distribution among four parallel GaN HEMTs, considering two symmetrical circuit layouts of a power cell. For switching experiments, 25 V input voltage and a maximum load current of 7 A are considered. Current through each GaN HEMT is measured using stud-type, high bandwidth, coaxial shunt current sensors (CSs). The same circuit is further investigated by removing the current sensors. A second circuit is built by eliminating the CSs as to achieve high current. The circuit is tested up to 27 A/ 80 V. Here, only the voltage measurements and thermal images are obtained. Thermal images are used to evaluate the power dissipation between the four HEMTs and to correlate them with the current measurements. Further, the current waveforms are simulated using a SPICE model. The parasitic elements of the layout are calculated by ANSYS Q3D.

Details

Database :
OpenAIRE
Journal :
2019 IEEE 7th Workshop on Wide Bandgap Power Devices and Applications (WiPDA)
Accession number :
edsair.doi.dedup.....322935dd0071884437c977be9ffc7bd6
Full Text :
https://doi.org/10.1109/wipda46397.2019.8998816