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Hybrid-RRAM toward Next Generation of Nonvolatile Memory: Coupling of Oxygen Vacancies and Metal Ions
- Source :
- Advanced Electronic Materials, Advanced Electronic Materials, Wiley, 2019, 5 (2), pp.1800658. ⟨10.1002/aelm.201800658⟩, Advanced Electronic Materials, Wiley, 2018, pp.1800658, Advanced Electronic Materials, 2018, 5 (2), pp.1800658. ⟨10.1002/aelm.201800658⟩, Advanced Electronic Materials, Wiley, 2018, 5, pp.1800658. ⟨10.1002/aelm.201800658⟩
- Publication Year :
- 2019
-
Abstract
- International audience; In this paper, the impact of copper and oxygen vacancy balance in filament composition as a key factor for oxide-based CBRAM (Hybrid RRAM) performances is investigated. To this aim, several RRAM technologies are studied using various resistive layers and top electrodes. Material analyses allow to highlight the hybrid aspect of HRRAM conductive filament. Density functional theory simulations are used to extract microscopic features and highlight differences from a material point of view. Integrated RRAM technology performances such as window margin, endurance and retention are then measured to analyze copper and oxygen vacancy influence on device characteristics. A new RRAM classification correlating filament composition and memory performances is proposed.
- Subjects :
- Chemical substance
Materials science
Programmable metallization cell
Oxide
02 engineering and technology
010402 general chemistry
01 natural sciences
Protein filament
chemistry.chemical_compound
nano-device
[SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics
ComputingMilieux_MISCELLANEOUS
[PHYS]Physics [physics]
Resistive touchscreen
reliability
business.industry
021001 nanoscience & nanotechnology
0104 chemical sciences
Electronic, Optical and Magnetic Materials
Resistive random-access memory
Non-volatile memory
chemistry
Optoelectronics
0210 nano-technology
business
Science, technology and society
hybrid rram
atomistic simulations
Subjects
Details
- ISSN :
- 2199160X
- Database :
- OpenAIRE
- Journal :
- Advanced Electronic Materials
- Accession number :
- edsair.doi.dedup.....3128b17e40069f0f256a63e654f5f8f2
- Full Text :
- https://doi.org/10.1002/aelm.201800658