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Interconnect Modeling using a Surface Admittance Operator Derived with the Fokas Method

Authors :
Bosman, Dries
Huynen, Martijn
De Zutter, Daniël
Sun, Xiao
Pantano, Nicolas
Van der Plas, Geert
Beyne, Eric
Vande Ginste, Dries
Source :
2022 IEEE 31ST CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2022)
Publication Year :
2022
Publisher :
IEEE, 2022.

Abstract

In this contribution, we propose a novel approach to rigorously model interconnect structures with an arbitrary convex polygonal cross-section and general, piecewise homogeneous, material parameters. A full-wave boundary integral equation formulation is combined with a differential surface admittance approach, invoking an extended form of the numerically fast Fokas method to construct the pertinent operator. Several examples validate our method and demonstrate its applicability to per-unit-of-length resistance and inductance characterization.

Details

ISBN :
978-1-66545-075-1
ISSN :
21654115
ISBNs :
9781665450751
Database :
OpenAIRE
Journal :
2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Accession number :
edsair.doi.dedup.....2fd3c4a9bbe14b68458409b3f683e81f
Full Text :
https://doi.org/10.1109/epeps53828.2022.9947108