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Interconnect Modeling using a Surface Admittance Operator Derived with the Fokas Method
- Source :
- 2022 IEEE 31ST CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2022)
- Publication Year :
- 2022
- Publisher :
- IEEE, 2022.
-
Abstract
- In this contribution, we propose a novel approach to rigorously model interconnect structures with an arbitrary convex polygonal cross-section and general, piecewise homogeneous, material parameters. A full-wave boundary integral equation formulation is combined with a differential surface admittance approach, invoking an extended form of the numerically fast Fokas method to construct the pertinent operator. Several examples validate our method and demonstrate its applicability to per-unit-of-length resistance and inductance characterization.
Details
- ISBN :
- 978-1-66545-075-1
- ISSN :
- 21654115
- ISBNs :
- 9781665450751
- Database :
- OpenAIRE
- Journal :
- 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
- Accession number :
- edsair.doi.dedup.....2fd3c4a9bbe14b68458409b3f683e81f
- Full Text :
- https://doi.org/10.1109/epeps53828.2022.9947108