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Waste-Derived Low-Cost Mycelium Nanopapers with Tunable Mechanical and Surface Properties

Authors :
Sabu John
Marina Kujundzic
Mitchell Jones
Johannes Theiner
Andreas Mautner
Alexander Bismarck
Eero Kontturi
Hanspeter Kählig
Kathrin Weiland
Royal Melbourne Institute of Technology University
University of Vienna
Department of Bioproducts and Biosystems
Aalto-yliopisto
Aalto University
Source :
Biomacromolecules. 20(9)
Publication Year :
2019

Abstract

Mycelium, the vegetative growth of filamentous fungi, has attracted increasing commercial and academic interest in recent years because of its ability to upcycle agricultural and industrial wastes into low-cost, sustainable composite materials. However, mycelium composites typically exhibit foam-like mechanical properties, primarily originating from their weak organic filler constituents. Fungal growth can be alternatively utilized as a low-cost method for on-demand generation of natural nanofibrils, such as chitin and chitosan, which can be grown and isolated from liquid wastes and byproducts in the form of fungal microfilaments. This study characterized polymer extracts and nanopapers produced from a common mushroom reference and various species of fungal mycelium grown on sugarcane byproduct molasses. Polymer yields of ∼10-26% were achieved, which are comparable to those of crustacean-derived chitin, and the nanopapers produced exhibited much higher tensile strengths than the existing mycelium materials, with values of up to ∼25 MPa (mycelium) and ∼98 MPa (mushroom), in addition to useful hydrophobic surface properties resulting from the presence of organic lipid residues in the nanopapers. HCl or H2O2 treatments were used to remove these impurities facilitating tuning of mechanical, thermal, and surface properties of the nanopapers produced. This potentially enables their use in a wide range of applications including coatings, membranes, packaging, and paper.

Details

ISSN :
15264602
Volume :
20
Issue :
9
Database :
OpenAIRE
Journal :
Biomacromolecules
Accession number :
edsair.doi.dedup.....2d36246dac0562971c56187845adab28