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Severe deformation twinning in pure copper by cryogenic wire drawing
- Source :
- Acta Materialia. 59:7816-7823
- Publication Year :
- 2011
- Publisher :
- Elsevier BV, 2011.
-
Abstract
- The effect of low-temperature on the active deformation mechanism is studied in pure copper. For this purpose, cryogenic wire drawing at liquid nitrogen temperature (77 K) was performed using molybdenum disulfide lubrication. Microstructural investigation and texture analysis revealed severe twin formation in the cryogenically drawn copper, with a broad twin size distribution. The spacing of the observed deformation twins ranges from below 100 nm, as reported in previous investigations, up to several micrometers. The extent of twin formation, which is significantly higher when compared to other cryo-deformation techniques, is discussed with respect to the state of stress and the texture evolution during wire drawing. � 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
- Subjects :
- Materials science
Polymers and Plastics
Wire drawing
Metallurgy
Metals and Alloys
chemistry.chemical_element
Deformation (meteorology)
Copper
Electronic, Optical and Magnetic Materials
Stress (mechanics)
Deformation mechanism
chemistry
Active deformation
Deformation twin
Deformation twinning
Liquid nitrogen temperature
Low temperature deformations
Low temperatures
Microstructural investigation
Molybdenum disulfide
Pure copper
Resolved shear stress
Severe Deformation
State of stress
Stress state
Texture analysis
Texture evolutions
Twin formation
Cryogenics
Deformation
Liquid nitrogen
Molybdenum
Textures
Wire
Critical resolved shear stress
Ceramics and Composites
Texture (crystalline)
Crystal twinning
Subjects
Details
- ISSN :
- 13596454
- Volume :
- 59
- Database :
- OpenAIRE
- Journal :
- Acta Materialia
- Accession number :
- edsair.doi.dedup.....291c12fab0c49534dd32e40fa5c86478
- Full Text :
- https://doi.org/10.1016/j.actamat.2011.08.042