(Invited) Water Transport Along Si/Si Direct Wafer Bonding Interfaces

International audience; The transport of water in a highly confined gap made by the directbonding of low roughness silicon hydrophilic wafers is studied.We derive the equation for the transport of water from chemicalpotential gradients, using Stokes and conservation equations. Thetransport equation is found to be a Porous Medium Equation withexponent 2. A solution for this equation with stepwise boundaryconditions is given. The model is tested against different initialconditions for inward and outward flow, and different temperaturesand humidity levels.