Stress intensity factor analysis of a three-dimensional interface crack between dissimilar anisotropic materials under thermal stress

A numerical method for evaluating the stress intensity factors (SIFs) of a three-dimensional interface crack between dissimilar anisotropic materials subjected to thermal and mechanical stresses is proposed. The M1-integral method was applied to an interfacial crack between three-dimensional anisotropic bimaterials under thermal stress. The moving least square approximation was utilized to calculate the value of the M1-integral. The M1-integral in conjunction with the moving least square approximation can be used to calculate the SIFs from nodal displacements obtained by finite element analysis. SIF analyses were performed for double edge cracks in jointed dissimilar isotropic semi-infinite plates subjected to thermal load. Excellent agreement was achieved between the numerical results obtained by the present method and the exact solution. In addition, we computed the SIFs of an external circular interfacial crack in jointed dissimilar anisotropic solids under thermal stress and showed the distributions of SIFs along the crack front. The distribution of stress and the crack opening displacement obtained by the asymptotic solution using the computed SIFs were compared with those obtained by the finite element analysis with fine mesh. They were almost identical to each other, except for the minor component of SIFs that is much smaller than the major component of SIFs. These results indirectly demonstrate the accuracy of the obtained SIFs.