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Morphological and stoichiometric optimization of Cu2O thin films by deposition conditions and post-growth annealing
- Source :
- Thin Solid Films
-
Abstract
- Thin films of copper oxide were grown by radio frequency-magnetron sputtering in an oxygen-argon environment onto silicon substrates at two different oxygen partial pressures (15% and 23%). Post deposition annealing in vacuum environment was conducted on the films at different temperatures (between 250 °C and 550 °C). We investigated the thin films by Scanning Electron Microscopy, Energy Dispersive X-ray, X-ray diffraction, Raman spectroscopy, Atomic Force Microscopy and Kelvin Probe Force Microscopy. These studies show that post-growth annealing in vacuum results in thin films with different morphological and stoichiometric properties. Furthermore, the oxygen partial pressure conditions during deposition have an impact over the obtained oxide phases: high oxygen partial pressure leads to the formation of two different oxide phases, i.e. CuO and Cu2O, while low oxygen partial pressure leads to the formation of Cu2O thin films. Notably, we also uncovered a parasitic crystallite growth as a result of aging on the pristine and low-temperature annealed samples, and we found out that high temperature annealing prevents this kind of aging.
- Subjects :
- Annealing in vacuum
Contact potential difference
Copper oxide phases
Crystallite growth
Metal oxide
Radio frequency-magnetron sputtering
Copper oxide
Materials science
Annealing (metallurgy)
Oxide
02 engineering and technology
01 natural sciences
chemistry.chemical_compound
Sputtering
0103 physical sciences
Materials Chemistry
Thin film
010302 applied physics
Kelvin probe force microscope
Metals and Alloys
Surfaces and Interfaces
Partial pressure
021001 nanoscience & nanotechnology
Surfaces, Coatings and Films
Electronic, Optical and Magnetic Materials
chemistry
Chemical engineering
Crystallite
0210 nano-technology
Subjects
Details
- Language :
- English
- ISSN :
- 00406090
- Volume :
- 732
- Database :
- OpenAIRE
- Journal :
- Thin Solid Films
- Accession number :
- edsair.doi.dedup.....22e102cf0008a827cdf1e52d890f4c44
- Full Text :
- https://doi.org/10.1016/j.tsf.2021.138763