Back to Search
Start Over
Quantitative thermal wave phase imaging of an IR semi-transparent GaAs wafer using IR lock-in thermography
- Source :
- Measurement Science and Technology, Measurement Science and Technology, 2017, 28 (2), pp.025008. ⟨10.1088/1361-6501/aa4f69⟩, Measurement Science and Technology, IOP Publishing, 2017, 28 (2), pp.025008. ⟨10.1088/1361-6501/aa4f69⟩
- Publication Year :
- 2017
- Publisher :
- HAL CCSD, 2017.
-
Abstract
- International audience; In this paper, the simultaneous measurement of out-of-plane thermal diffusivity and effective infrared absorption coefficient of an IR semi-transparent GaAs wafer using infrared lock-in thermography technique (LIT) is presented. The method relies on analysis of the generated LIT phase images recorded at different modulation frequencies, using the thermal wave model in the transmission configuration. The out-of-plane thermal diffusivity and effective infrared absorption coefficient are estimated from the best fit of the theoretical model to the experimental data. The obtained values are in good agreement with those obtained by supplementary measurement using the modulated photothermal infrared radiometry technique (PTR) in the reflection mode, and also with data reported in the literature. In addition, simple modification of the LIT experiment set up allows one to determinate the in-plane thermal diffusivity of n-GaAs wafer. It was found that in-plane and out-of-plane thermal diffusivities of the GaAs wafer are very close, as expected, within the limit of measurement errors. The results show that the LIT technique in transmission configuration can provide spatial information about both the (effective) infrared absorption coefficient and thermal diffusivity of semiconductor crystals.
- Subjects :
- Materials science
Infrared
Infrared spectroscopy
02 engineering and technology
Thermal diffusivity
01 natural sciences
7. Clean energy
[SPI.MAT]Engineering Sciences [physics]/Materials
010309 optics
[SPI]Engineering Sciences [physics]
Optics
0103 physical sciences
Thermal
Wafer
Instrumentation
Engineering (miscellaneous)
ComputingMilieux_MISCELLANEOUS
[PHYS]Physics [physics]
[SPI.GCIV.CD]Engineering Sciences [physics]/Civil Engineering/Construction durable
business.industry
Applied Mathematics
[SPI.NRJ]Engineering Sciences [physics]/Electric power
[SPI.MECA]Engineering Sciences [physics]/Mechanics [physics.med-ph]
021001 nanoscience & nanotechnology
Semiconductor
Thermography
[SPI.OPTI]Engineering Sciences [physics]/Optics / Photonic
Optoelectronics
Radiometry
0210 nano-technology
business
[SPI.GCIV.EC]Engineering Sciences [physics]/Civil Engineering/Eco-conception
Subjects
Details
- Language :
- English
- ISSN :
- 09570233 and 13616501
- Database :
- OpenAIRE
- Journal :
- Measurement Science and Technology, Measurement Science and Technology, 2017, 28 (2), pp.025008. ⟨10.1088/1361-6501/aa4f69⟩, Measurement Science and Technology, IOP Publishing, 2017, 28 (2), pp.025008. ⟨10.1088/1361-6501/aa4f69⟩
- Accession number :
- edsair.doi.dedup.....206beeb7c7e0a5cff8eedeb1d08275bb
- Full Text :
- https://doi.org/10.1088/1361-6501/aa4f69⟩