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Effect of Trapped Solvent on the Interface between PS-b-PMMA Thin Films and P(S-r-MMA) Brush Layers
- Publication Year :
- 2020
-
Abstract
- The orientation of block copolymer (BCP) features in thin films can be obtained by spin-coating a BCP solution on a substrate surface functionalized by a polymer brush layer of the appropriate random copolymer (RCP). Although this approach is well established, little work reporting the amount and distribution of residual solvent in the polymer film after the spin-coating process is available. Moreover, no information can be found on the effect of trapped solvent on the interface between the BCP film and RCP brush. In this work, systems consisting of poly(styrene)-b-poly(methyl methacrylate) thin films deposited on poly(styrene-r-methyl methacrylate) brush layers are investigated by combining neutron reflectivity (NR) experiments with simulation techniques. An increase in the amount of trapped solvent is observed by NR as the BCP film thickness increases accompanied by a significant decrease of the interpenetration length between the BCP and RCP, thus suggesting that the interpenetration between grafted chains and block copolymer chains is hampered by the solvent. Hybrid particle-field molecular dynamics simulations of the analyzed system confirm the experimental observations and demonstrate a clear correlation between the interpenetration length and the amount of trapped solvent.
- Subjects :
- Materials science
neutron reflectivity
block copolymer
02 engineering and technology
Polymer brush
Methacrylate
01 natural sciences
chemistry.chemical_compound
0103 physical sciences
Copolymer
trapped solvent
General Materials Science
Methyl methacrylate
Thin film
molecular dynamics
thin polymer films
chemistry.chemical_classification
010304 chemical physics
molecular dynamic
thin polymer film
Polymer
021001 nanoscience & nanotechnology
Solvent
chemistry
Chemical engineering
0210 nano-technology
Layer (electronics)
Subjects
Details
- Language :
- English
- Database :
- OpenAIRE
- Accession number :
- edsair.doi.dedup.....1c6009d0ede4638a7b25d4d468eb7384