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Dynamics of grain boundaries in two-dimensional hydrogen-bonded molecular networks
- Source :
- Small (Weinheim an der Bergstrasse, Germany). 1(5)
- Publication Year :
- 2006
-
Abstract
- The temporal evolution of domain boundaries of hydrogen-bonded molecular monolayers at the liquid–solid interface is evaluated by recording series of subsequent scanning tunneling microscopy (STM) images. Comparison of dissimilar benzene carboxylic acids reveals a clear distinction between one- and two-dimensional H-bonded network structures. Trimesic acid forms a two-dimensionally H-bonded networked structure, whereas terephthalic acid organizes in a dense packing of H-bonded linear chains on a graphite surface. In addition, TMA forms a sixfold lattice on a threefold graphite substrate, whereas TPA exhibits only a twofold lattice, causing a high grain-boundary line energy for the latter. In the case of TMA the nanostructure was mostly stable during the observation time. For TPA, Ostwald ripening—that is, the growth of larger islands at the expense of smaller islands—was observed. To explain the various experimentally observed timescales of the dynamics occurring at grain boundaries, molecular mechanics simulations were applied to calculate the binding energy of edge molecules, that is, the line energy, of finite islands of both trimesic and terephthalic acid on a graphite substrate.
- Subjects :
- Models, Molecular
Nanostructure
Hot Temperature
Time Factors
Binding energy
Carboxylic Acids
Phthalic Acids
law.invention
Biomaterials
chemistry.chemical_compound
Molecular dynamics
law
Microscopy, Scanning Tunneling
Nanotechnology
General Materials Science
Graphite
Temperature
Tricarboxylic Acids
Benzene
Hydrogen Bonding
General Chemistry
Crystallography
chemistry
Solvents
Thermodynamics
Grain boundary
Self-assembly
Trimesic acid
Adsorption
Scanning tunneling microscope
Biotechnology
Subjects
Details
- ISSN :
- 16136829
- Volume :
- 1
- Issue :
- 5
- Database :
- OpenAIRE
- Journal :
- Small (Weinheim an der Bergstrasse, Germany)
- Accession number :
- edsair.doi.dedup.....1c4464c25162745d6412541ecd53d40b