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Gallium nitride MEMS resonators: how residual stress impacts design and performances
- Source :
- Microsystem Technologies, Microsystem Technologies, Springer Verlag, 2018, 24 (1), pp.371-377. ⟨10.1007/s00542-017-3293-0⟩, Microsystem Technologies, 2018, 24 (1), pp.371-377. ⟨10.1007/s00542-017-3293-0⟩
- Publication Year :
- 2017
- Publisher :
- Springer Science and Business Media LLC, 2017.
-
Abstract
- International audience; Starting from Gallium Nitride epitaxially grown on silicon, pre-stressed micro-resonators with integrated piezoelectric transducers have been designed, fabricated, and characterized. In clamped-clamped beams, it is well known that tensile stress can be used to increase the resonant frequency. Here we calculate the mode shape functions of out-of-plane flexural modes in pre-stressed beams and we derive a model to predict both the resonant frequency and the piezoelectric actuation factor. We show that a good agreement between theory and experimental results can be obtained and we derive the optimal design for the electromechanical transduction. Finally, our model predicts an increase of the quality factor due to the tensile stress, which is confirmed by experimental measurements under vacuum. This study demonstrates how to take advantage from the material quality and initial stress resulting of the epitaxial process.
- Subjects :
- Microelectromechanical systems
Materials science
Gallium nitride
02 engineering and technology
021001 nanoscience & nanotechnology
Condensed Matter Physics
01 natural sciences
Piezoelectricity
Electronic, Optical and Magnetic Materials
Stress (mechanics)
[SPI]Engineering Sciences [physics]
chemistry.chemical_compound
Resonator
Quality (physics)
chemistry
Flexural strength
Hardware and Architecture
Residual stress
0103 physical sciences
Electrical and Electronic Engineering
Composite material
010306 general physics
0210 nano-technology
Subjects
Details
- ISSN :
- 14321858 and 09467076
- Volume :
- 24
- Database :
- OpenAIRE
- Journal :
- Microsystem Technologies
- Accession number :
- edsair.doi.dedup.....1b304c00cd5fa7abfa332bf3d9bb6d22
- Full Text :
- https://doi.org/10.1007/s00542-017-3293-0