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Implementation and Characterization of a Two-Dimensional Printed Circuit Dynamic Metasurface Aperture for Computational Microwave Imaging
- Publication Year :
- 2019
-
Abstract
- We present the design, fabrication, and experimental characterization of a 2-D, dynamically tuned, metasurface aperture, emphasizing its potential performance in computational imaging applications. The dynamic metasurface aperture (DMA) consists of an irregular, planar cavity that feeds a multitude of tunable metamaterial elements, all fabricated in a compact, multilayer printed circuit board process. The design considerations for the metamaterial element as a tunable radiator, the associated biasing circuitry, as well as cavity parameters are examined and discussed. A sensing matrix can be constructed from the measured transmit patterns, the singular value spectrum of which provides insight into the information capacity of the apertures. We investigate the singular value spectra of the sensing matrix over a variety of operating parameters, such as the number of metamaterial elements, number of masks (aka tuning states), and number of radiating elements. After optimizing over these key parameters, we demonstrate computational microwave imaging of simple test objects.
- Subjects :
- Materials science
Aperture
Holography
FOS: Physical sciences
Physics::Optics
Applied Physics (physics.app-ph)
02 engineering and technology
law.invention
Printed circuit board
Matrix (mathematics)
Optics
Planar
law
Radar imaging
FOS: Electrical engineering, electronic engineering, information engineering
0202 electrical engineering, electronic engineering, information engineering
Electrical and Electronic Engineering
business.industry
Image and Video Processing (eess.IV)
Metamaterial
020206 networking & telecommunications
Physics - Applied Physics
Electrical Engineering and Systems Science - Image and Video Processing
Microwave imaging
business
Optics (physics.optics)
Physics - Optics
Subjects
Details
- Language :
- English
- Database :
- OpenAIRE
- Accession number :
- edsair.doi.dedup.....164b5ac135db8024119f4e7914c73008