Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

MLA

Mitsuaki Kato, et al. “Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model.” Journal of Electronic Packaging, vol. 145, Sept. 2022. EBSCOhost, https://doi.org/10.1115/1.4055394.

APA

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, & Kenji Hirohata. (2022). Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model. Journal of Electronic Packaging, 145. https://doi.org/10.1115/1.4055394

Chicago

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, and Kenji Hirohata. 2022. “Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model.” Journal of Electronic Packaging 145 (September). doi:10.1115/1.4055394.