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Modeling and Evaluation of Application-Aware Dynamic Thermal Control in HPC Nodes
- Source :
- IFIP Advances in Information and Communication Technology, 25th IFIP/IEEE International Conference on Very Large Scale Integration-System on a Chip (VLSI-SoC), 25th IFIP/IEEE International Conference on Very Large Scale Integration-System on a Chip (VLSI-SoC), Oct 2017, Abu Dhabi, United Arab Emirates. pp.198-219, ⟨10.1007/978-3-030-15663-3_10⟩, VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things ISBN: 9783030156626, VLSI-SoC (Selected Papers)
- Publication Year :
- 2017
- Publisher :
- HAL CCSD, 2017.
-
Abstract
- International audience; As side effects of the end of Dennard’s scaling, power and thermal technological walls stand in front of the evolution of supercomputers towards the exaflops era. Energy and temperature walls are big challenges to face for assuring a constant grow of performance in future. New generation architectures for HPC systems implement HW and SW components to address energy and thermal issues for increasing power and efficient computing in scientific workload. In thermal-bound HPC machines, workload-aware runtimes can leverage hardware knobs to guarantee the best operating point in term of performance and power saving without violating thermal constraints.In this paper, we present an integer-linear programming formulation for job mapping and frequency selection for thermal-bound HPC nodes. We use a fast solver and workload traces extracted from a real supercomputer to test our methodology. Our runtime is integrated into the MPI library, and it is capable of assigning high-performance cores to performance-critical processes. Critical processes are identified at execution time through a mathematical formulation, which relies on the characterization of the application workload and on the global synchronization barriers. We demonstrate that by combining long and short horizon predictions with information on the critical processes retrieved from the programming model, we can drastically improve the performance of the target application w.r.t. state-of-the-art DTM solutions.
- Subjects :
- ILP
Workload model
Computer science
Power model
Power saving
02 engineering and technology
01 natural sciences
Thermal constraint
Energy saving
0103 physical sciences
0202 electrical engineering, electronic engineering, information engineering
Leverage (statistics)
[INFO]Computer Science [cs]
010302 applied physics
Operating point
business.industry
Workload
Thermal model
Thermal control
020202 computer hardware & architecture
DTM
Runtime
Embedded system
HPC
Quantum ESPRESSO
MPI
business
Subjects
Details
- Language :
- English
- ISBN :
- 978-3-030-15662-6
- ISBNs :
- 9783030156626
- Database :
- OpenAIRE
- Journal :
- IFIP Advances in Information and Communication Technology, 25th IFIP/IEEE International Conference on Very Large Scale Integration-System on a Chip (VLSI-SoC), 25th IFIP/IEEE International Conference on Very Large Scale Integration-System on a Chip (VLSI-SoC), Oct 2017, Abu Dhabi, United Arab Emirates. pp.198-219, ⟨10.1007/978-3-030-15663-3_10⟩, VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things ISBN: 9783030156626, VLSI-SoC (Selected Papers)
- Accession number :
- edsair.doi.dedup.....14aef0d2177eb508f9fbac59bbf4db4e
- Full Text :
- https://doi.org/10.1007/978-3-030-15663-3_10⟩